Circuit design and optics system for infrared signal transceivers

ABSTRACT

An Improved Circuit Design and Optics System for Infrared Signal Transceivers is disclosed. The preferred system includes an IR transceiver assembly that is easily grasped by assemblers. Furthermore, the primary and secondary lenses associated with the transceiver system are easier to manufacture than current lens designs. Also, the heretofore critical lens separation between the infrared emitting and infrared detection devices and the primary lens is rendered a flexible dimension, dependent only upon the particular appliance in which the system is installed. The present invention permits the stand for infrared emitting and infrared detection devices to be eliminated as a result of exchanging a non-imaging transceiver system with the current imaging transceiver system. The present invention further comprises assembling or otherwise combining infrared emitting and infrared detection devices into a single infrared emitting/infrared detection device stack. Finally, the present invention provides a Ir transceiver assembly that has a smaller footprint by backside mounting and/or stacking the discrete devices.

CROSS REFERENCE TO RELATED APPLICATION

This application is a continuation of, and claims priority under 35U.S.C. §120 from, nonprovisional U.S. patent application Ser. No.09/285,608, filed on Apr. 2, 1999, now abandoned, the subject matter ofwhich is incorporated herein by reference. Application Ser. No.09/285,608 is a continuation-in-part of, and claims priority under 35U.S.C. §120 from, nonprovisional U.S. patent application Ser. No.09/113,036 filed on Jul. 9, 1998, now U.S. Pat. No. 6,281,999, thesubject matter of which is incorporated herein by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

This invention relates generally to infrared communications systems and,more specifically, to an Improved Circuit Design and Optics System forInfrared Signal Transceivers.

2. Description of Related Art

As technology becomes continually more accessible to the “common man,”the ability to use, store, transfer and otherwise manipulate informationhas become the focus of most businesses as well as for the individualconsumer. Access to the information resources is commonly by some sortof network system, including World Wide Web, “Intranets”, local areanetworks, wide area networks, as well as corporate databases.

While the conventional method for connecting to one of these informationnetworks has been via cable and wire, as the reliance upon connectivityto information has deepened, the desire to gain such access from mobileor portable devices has strengthened. These portable devices, such asPersonal Digital Assistants, handheld computers, and even cellulartelephones are now being connected to each other and to networks viaInfrared Data Communications. In fact, it is virtually impossible topurchase a notebook computer today that does not include an InfraredData Communications assembly resident within it.

FIG. 1 depicts the typical infrared data communications hardware that isinstalled in electronic devices; it is a perspective view of a priorinfrared transceiver assembly 10. As discussed above, these assemblies10 are found in virtually every notebook computer sold today. Thecomponents of the assembly 10 are virtually identical across allmanufacturers' product lines, with few exceptions. The typical assembly10 comprises a housing 12 within which the infrared emitting device andinfrared detection device (see FIG. 2) are mounted. The “transceiver” isactually data processing circuitry for managing the infrared emittingdevice and infrared detection device; its location is therefore notoptically-dependent (and, in fact, it operates better in “IR darkness”).The housing 12 usually is molded from plastic, with a primary lens unit14 formed in one of the sides of the housing 12. As can be seen, theconventional primary lens unit 14 comprises two lenses; one each for theinfrared emitting device and infrared detection device (both lenses withsimilar optical properties, and both requiring precision andreproducibility). Adjacent to the housing 12, is a protective lens 16.The protective lens 16 is generally constructed from a colored plasticthat is transparent to infrared signals. In most cases, the protectivelens 16 is attached to the external case of the electronic device, itspurpose being to protect the inner workings of the device, while alsopermitting infrared signals to pass in and out. FIG. 3 gives furtherdetail regarding the workings of the prior assembly 10.

FIG. 2 is a cutaway side view of the prior infrared transceiver assembly10 of FIG. 1. As can be seen, the housing 12 is generally attached tothe “motherboard” 18 or other printed circuit board within theelectronic device. Within the housing 12 is located an infraredemitting/infrared detection device pair 20. It should be understood thatit is also common to place more than a single infrared emitting deviceand/or infrared detection device inside of one housing 12 (e.g. twoinfrared emitting devices and one infrared detection device, etc.); aninfrared emitting device and infrared detection device pair 20 is usedhere simply in the interest of brevity.

The infrared emitting device and infrared detection device pair 20transmit and receive infrared signals. The infrared emitting device andinfrared detection device pair 20 is typically mounted to a stand 22,and thereby positioned in the signal path of the primary lens 14 inorder to send and receive infrared signals therethrough. As discussedearlier, the appliance case 24 has an aperture 25 formed therein, andinto which a protective lens 16 is installed. The protective lens 16simply protects the inner workings of the appliance from contamination.

This prior assembly 10 has several deficiencies. First, the protrusionof the primary lens unit 14 can make the housing 12 difficult to graspby humans and/or machines assembling the electronic devices. Thedifficulty in grasping can result in manufacturing defects, productiondelays, and generally higher costs of production. What is needed is aprimary lens unit design that does not present a grasping difficulty toassemblers.

Second, the primary lens unit 14 mandates higher manufacturing anddesign standards than the average plastic housing for an electronicdevice to insure that the light-refractive traits of the primary lens 14are predictable and repeatable. Because the primary lens unit 14 isintegral to the housing 12, the entire housing 12 becomes subject to theelevated quality standards. It would be much more cost-effective if thedesign of the integral primary lens unit 14 did not mandate elevatedquality standards for the entire housing 12.

Other defects with the prior assembly 10 are illustrated by FIG. 3. FIG.3 is a cutaway side view of the transceiver assembly 10 of FIGS. 1 and2, depicting the typical transmit dispersion angle θ_(T) of the assembly10. By current IrDA (Infrared Data Association) standards, the transmitdispersion angle θ_(T) must be at least 15 (fifteen) degrees from thefocal axis 26 (in two dimensions, of course). The transmit dispersionangle θ_(T) is the sum-total of the primary lens refraction angle θ₁ andthe protective lens refraction angle θ₂. All prior assemblies 10 includea protective lens 16 that has no refractive power; the protective lens10 refraction angle θ₂ is, therefore, typically 0 degrees. Consequently,the conventional primary lens unit refraction angle θ₁ is 15 (fifteen)degrees.

There are several design implications resulting from having the entiretransmit dispersion angle θ_(T) provided by the primary lens unit 14.The infrared emitting device and infrared detection device pair 20 mustbe located at the focal point 30 of the primary lens unit 14 in order toinsure that no signal data is lost. As such, the height 28 (as well ashorizontal placement) of the infrared emitting device and infrareddetection device pair 20 is very specifically defined. Moreover, thestand (see FIG. 2) must be included in order to raise the infraredemitting device/infrared detection device pair 20 above the printedcircuit board 18. It would be a better arrangement if the infraredemitting device/infrared detection device pair 20 could be mounteddirectly to the printed circuit board 18. Furthermore, the separation 32between the primary lens unit 14 and the protective lens 16 is verycritical. Unless the primary lens unit 14 is very close to theprotective lens 16, the protective lens 16 must be relatively large orelse the mandated angular dispersion will not be met. A large protectivelens 16 can be a serious design constraint for the smaller electronicdevices, where component real estate is very tight. What would be betteris a design that permits the protective lens 16 to be very small, allowsthe lens separation distance 32 to be flexible, and still meets the IrDAangular dispersion requirements.

Another problem exists in regard to the conventional design for IFinfrared transceiver assemblies. As can be seen from FIG. 9, whichdepicts the infrared transceiver assembly 10 of FIGS. 1 and 2, theinfrared transceiver assembly 10 comprises a housing 12 within which isfound a PC board 18. It is understood that the PC board in some casesmight be replaced with a lead frame. The PC board generally has a frontside 68 and a back side 70; the housing 12 is typically formed with aninfrared detection device lens element 14A and an infrared emittingdevice lens element 14B (which together comprise primary lens element 14described above in connection with FIG. 1). Mounted on the PC board 18and in the optical path of the infrared detection device lens element14A is a conventionally infrared detection device 64. Also mounted onthe PC board 18, and in the optical path of the infrared emitting devicelens element 14B, is an infrared emitting device 62. Transceiver circuitdevice 72, which is typically an integrated circuit device comprisinghardware which can send and receive signals from the infrared emittingdevice 62 and the infrared detection device 64, respectively, is alsoattached to the PC board 18, (geographically located between theinfrared detection device 64 and the infrared emitting device 62). Forthe PC board 18 situation, transceiver circuit device 72, infrareddetection device 64 and infrared emitting device 62 are electricallyconnected to the pc board 18 via connection means 74 which in this caseis of the wire bond type conventionally known in the field. A problemwith conventional infrared transceiver assemblies 10 is one of realestate. In the package shown in FIG. 9, the requirement for separatefootprints for the infrared emitting device 62, the infrared detectiondevice 64 and the transceiver circuit device 72L mandates that the PCboard 18 is wide and further mandates that there be a plurality of lenselements. It would be beneficial if this large combination of footprintscould be minimized by reducing the device size of the transceiverassembly and potentially the cost, among other advantages.

SUMMARY OF THE INVENTION

In light of the aforementioned problems associated with the priordevices, it is an object of the present invention to provide an improvedcircuit design and optics system for infrared signal transceivers. It isa further object that the improved system include an infraredtransceiver assembly that is easily grasped by assemblers. It is also anobject that the primary and secondary lenses associated with thetransceiver system be easier to manufacture than current lens designs.It is a still further object that the heretofore critical lensseparation between the infrared emitting and infrared detection devicesand the primary lens become a flexible dimension, dependent only uponthe particular appliance in which the system is installed. It is anotherobject that the stand for infrared emitting and infrared detectiondevices be eliminated as a result of exchanging a non-imagingtransceiver system with the current imaging transceiver system. Finally,it is an object that infrared emitting and infrared detection devices beassembled or otherwise combined into a single infrared emitting/infrareddetection device stack. A further object of the present invention is toprovide and improved the infrared transceiver assembly that has muchsmaller outside dimensions than the current state of the art.

BRIEF DESCRIPTION OF THE DRAWINGS

The objects and features of the present invention are set forth withparticularity in the appended claims. The present invention, both as toits organization and manner of operation, together with further objectsand advantages, may best be understood by reference to the followingdescription, taken in connection with the accompanying drawings,wherein:

FIG. 1 (prior art) is a perspective view of a prior art infraredtransceiver assembly;

FIG. 2 (prior art) is a cutaway side view of the prior art infraredtransceiver assembly of FIG. 1;

FIG. 3 is a cutaway side view of the transceiver assembly of FIGS. 1 and2, depicting the typical transmit dispersion angle;

FIG. 4 is a cutaway side view of a preferred embodiment of the improvedtransceiver assembly of the present invention;

FIG. 5 is a cutaway side view of another preferred embodiment of theimproved transceiver assembly of the present invention;

FIG. 6 is a partial cutaway side view of yet another preferred featureof the improved transceiver assembly of the present invention;

FIG. 7 is a partial perspective view of still another preferredembodiment of the present invention;

FIG. 8 is a partial cutaway side view of an integrated infrared emittinginfrared detection device stack of the present invention;

FIG. 9 (prior art) is a cutaway top view of a conventional infraredtransceiver assembly depicted in FIG. 1;

FIG. 10 is a cutaway top view of the improved infrared transceiverassembly of the present invention depicting a backside-mountedtransceiver circuit device;

FIG. 11 is a cutaway top view of another improved infrared transceiverassembly depicting another backside-mounted transceiver circuit devices;

FIG. 12 is a cutaway top view of yet another improved infraredtransceiver assembly depicting an integrated infrared emitting infrareddetection device and a backside mounted transceiver circuit device;

FIG. 13 is a cutaway top view of another improved infrared transceiverassembly also employing the integrated infrared emitting infrareddetection device of the present invention and another example of abackside-mounted transceiver circuit device; and

FIG. 14 is a cutaway top view of still another improved infraredtransceiver assembly using a front side-mounted transceiver/infraredemitting infrared detection device stack.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

The following description is provided to enable any person skilled inthe art to make and use the invention and sets forth the best modescontemplated by the inventors of carrying out their invention. Variousmodifications, however, will remain readily apparent to those skilled inthe art, since the generic principles of the present invention have beendefined herein specifically to provide an Improved Optics System forInfrared Signal Transceivers.

The present invention can best be understood by initial consideration ofFIG. 4. FIG. 4 is a cutaway side view of a preferred embodiment of theimproved transceiver assembly 34 of the present invention. Similar tothe prior assemblies, this improved assembly comprises a housing 36 anda secondary lens 40, which are separated by a distance 38. What isunique about this particular assembly 34 is the optical characteristicsof the secondary lens 40. Instead of simply being a protective cover forthe electronics, this secondary lens 40 also has refractivecharacteristics. As such, the transmit dispersion angle θ_(TA) of thispreferred assembly 34 is equal to the primary lens unit refraction angleθ_(1A) plus the additional secondary lens refraction angle θ_(2A). Inthis new arrangement, therefore, a much wider field of transmission ispossible, because the transmit dispersion angle OTA can be increased towell beyond the standard fifteen degrees. Furthermore, the secondarylens 40 can be exchangeable with other secondary lenses having differentoptical characteristics. In this manner, a limitless variety ofdispersion angles θ_(TA) can be achieved for a single piece ofequipment.

Now turning to FIG. 5, we might further explore the implications andbenefits of the new design. FIG. 5 is a cutaway side view of anotherpreferred embodiment of the improved transceiver assembly 42 of thepresent invention. Similar to the assembly 34 of FIG. 4, this assembly42 comprises a secondary lens 40 that has refractive power. In thispresent embodiment, however, the primary lens unit 46 has no refractivepower (i.e. θ_(1B)=0 degrees). As such, the entire transmit dispersionangle θ_(TB) is determined by the contributions from the secondary lens40; no redirection of the light occurs as it passes through the primarylens unit 46.

Because there is no redirection of the light by the primary lens unit46, the lens separation distance 52 ceases to be determined by the sizeof the aperture (see FIG. 2) and secondary lens 40. This provides asignificant advantage over the prior assemblies because the housing 44can be placed in a location on the PC board that is convenient to the PCboard layout, without the concern for its distance from the case (andthe secondary lens 40).

Furthermore, there are other benefits to this new design. Since there isno focussing of the light by the primary lens unit 46, there is no focalpoint for the light. The conventional infrared emitting device/infrareddetection device pair 20 can be replaced with “non-imaging” infraredemitting device/infrared detection device pair 50 that is not dependentupon a focal point. “Non-imaging” infrared detection devices simplydetect any (and all) incident infrared light—they are commonly lessexpensive than the “imaging” infrared detection devices in use byconventional IR transceiver assemblies. The incident (and transmitted)light may simply be redirected by a mirror 48 and down to (or out from)the infrared emitting device/infrared detection device pair 50. Becausethere is no longer a focal point to deal with, the location of theinfrared emitting device/infrared detection device pair 50 is veryflexible. In fact, it would be natural to mount the infrared emittingdevice/infrared detection device pair 50 directly onto the PC board,with the infrared emitting device/infrared detection device height 28being effectively zero. This means that the infrared emittingdevice/infrared detection device pair 50 can be mounted easily byconventional PC board assembly processes—the housing might actually beadded on later. Consequently, the manufacturing costs attributable tothe IR transceiver assembly 42 are substantially reduced.

In another series of embodiments, there may be different dispersionangles for different regions of the secondary lens 56. An example isprovided in FIG. 6, which is a partial cutaway side view of yet anotherpreferred embodiment of the improved transceiver assembly 54 of thepresent invention. In this Figure, the transmit dispersion angle θ_(TC)is equal to the total of the secondary lens upper region refractionangle θ_(2C) and the secondary lens lower region refraction angleφ_(2C). As can be seen, these two regions have different refractingcharacteristics. It should be appreciated that a virtually limitless setof combinations of different refracting regions may be desired. FIG. 7is a partial perspective view of still another preferred embodiment ofthe infrared transceiver assembly 58 of the present invention. In thisembodiment, the secondary lens 60 is divided into four regions, eachhaving unique refractive characteristics, as indicated by the upper leftrefraction angle θ_(2DL), the upper right refraction angle θ_(2DR), thelower left refraction angle φ_(2DL), and the lower right refractionangle φ_(2DR). Again, it should be apparent that this is simply onedesign example; a wide variety of regions and refraction characteristicsis expected.

It is also possible that a secondary lens employing shiftable and/orvariable refracting regions is currently available, such as via LiquidCrystal technology. Furthermore, the secondary lens might be configuredto mask out certain regions by being selectively opaque to infraredsignal transmission. Each of these features is a significant advancementover the prior devices.

Another significant advancement of the present invention involvesassembling or otherwise combining the infrared emitting device/infrareddetection device pair into a single, integrated infraredemitting/infrared detection device stack 66, as depicted by FIG. 8. Theinfrared emitting device is much smaller than the infrared detectiondevice (0.3 mm² vs. 1.8 mm conventionally); furthermore, the infraredemitting device circuitry is conventionally built upon a transparentsubstrate. It is an aspect of the present invention that the infraredemitting device 62 be placed directly on top of the infrared detectiondevice 64 (i.e. in the path of incident and exiting IR signals) to forman integrated infrared emitting/infrared detection device stack 66. Thiswas very difficult under prior transceiver assembly designs, because theinfrared emitting device and infrared detection device would most likelyhave different focal points. Under the improvement described previouslyherein, however, the focal point of the primary lens unit is no longeran issue.

Now turning to FIG. 10, we can take a look at another embodiment of thepresent invention. FIG. 10 is a cutaway top view of the improvedinfrared transceiver assembly 76 of the present invention depicting abackside-mounted transceiver circuit device 72. Similar to FIG. 9, thedevice of FIG. 10 has a PC board 18 having a front side 68 and abackside 70. Also, this transceiver assembly 76 includes an infrareddetection device lens element 14A and an infrared emitting device lenselement 14B located to the front side 68 of the PC board 18 andelectrically connected through connection means 74. What is unique aboutthis present embodiment is that the transceiver circuit device 72 isactually located on the backside 70 of the PC board 18. In this case,the transceiver circuit device 72 is electrically connected to the PCboard 18 via alternate connection means 78, which in this case comprises“bump” attachment (a common device soldering method). As can be seenfrom 10 the improved assembly 76 of FIG. 10, since the transceivercircuit device 72 is no longer located between the infrared detectiondevice lens element 14A and the infrared emitting device lens element14B, the width of PC board 18 and therefore the size of the housing 12is much narrower, allowing the assembly 76 to be much smaller in size.

If we now turn to FIG. 11, we can see yet another embodiment of animproved infrared transceiver assembly 80. FIG. 11 is a cutaway top viewof another improved infrared transceiver assembly depicting anotherbackside-mounted transceiver circuit device 72. In FIG. 11, the basestructure is a lead frame 82. A lead frame, like the PC board of theprevious figures, is a common device mounting structure in thesemi-conductor and electronics industry. The lead frame 82 has a backside 84 and a front side 86, just as with the PC board 18. In thetransceiver assembly 80 of this preferred embodiment, the infrareddetection device 64 and infrared emitting device 62 are both attached tothe front side of the lead frame 86, however in this case, thetransceiver circuit device 72 is attached to the backside of the leadframe 84, through the conventional connection means 74, comprisingtypical wire bond interconnection for electrical conductance. Just aswith assembly 76 in FIG. 10, this embodiment 80 provides the advantageof a reduced package size, as well as providing at least two mountingand connection options for the transceiver circuit device 72.

FIG. 12 depicts yet another improved infrared transceiver assembly 88 ofthe present invention. FIG. 12 is a cutaway top view of yet anotherimproved infrared transceiver assembly 88 depicting an integratedinfrared emitting/infrared detection device stack 66 and abackside-mounted transceiver circuit device 72. In this embodiment, theintegrated infrared 10 emitting/infrared detection device stack 66 isemployed on the front side of the PC board 68 and connected thereto viaconnection means 74. Since the infrared emitting/infrared detectiondevice stack 66 is integrated, the need for two lens elements iseliminated, resulting in a single primary lens element 14C. Furthermore,the transceiver circuit device 72 is attached to the backside of the PCboard 70, just as described above in connection with FIG. 10. As can beappreciated, this preferred embodiment of the transceiver assembly 88provides even further package size reduction over the previous units.

Similarly, FIG. 13 depicts the integrated infrared emitting/infrareddetection device stack 66 attached to the lead frame's front side 86with the transceiver circuit device 72 being attached to the backside ofthe lead frame 84. FIG. 13 is a cutaway top view of another improvedinfrared transceiver assembly 89 also employing the integrated infraredemitting/infrared detection device stack 66 of the present invention andanother example of a backside-mounted transceiver circuit device 72.Again, like the assembly 88 of FIG. 12, this present embodiment of animproved infrared transceiver assembly 89 provides significant benefitsin package size reduction.

Finally, we will turn to FIG. 14 to examine yet another preferredembodiment of an improved infrared transceiver assembly 90. FIG. 14 is acutaway top view of still another improved infrared transceiver assembly90 having a front side-mounted transceiver/infrared emitting/infrareddetection device stack. This assembly 90 provides the smallest packagesize yet. In this case, the integrated infrared emitting/infrareddetection device stack 66 and the transceiver circuit device 72 arestacked together in a transceiver/infrared emitting/infrared detectiondevice stack 96. Since the infrared emitting/infrared detection devicestack 66 and the transceiver circuit device 72 are stacked, all devicescan be attached to the front side of the circuit structure 94. As can beappreciated, the circuit structure 92 might comprise a PC board or alead frame or other conventional structural circuit-providing devicesconventional in the art. It should be understood from this view thatsince all of the devices are attached to the front side of the circuitstructure 94, the housing 12 is not only reduced in width, but is alsothinner in depth than those improvements previously described inconnection with FIGS. 10 through 13. In other embodiments, there mightbe multiple infrared emitting/infrared detection device stacks 66 spreadout over the face of a single transceiver circuit device 72, which isthen attached to the front side of the circuit structure 94.Furthermore, and as discussed previously in connection with FIGS. 3through 8, while a single primary lens element 14C is shown here, thisimproved infrared transceiver assembly 90 might also include anembodiment where there is a primary lens element 14C as well as asecondary lens element 40. Still further, the embodiment is conceivedwhere in a single device, the transceiver circuitry as well as theinfrared emitting device and infrared detection device circuitry arecombined such that a single set of connection means 74 attaches thisintegrated device to the circuit structure front side 94.

Those skilled in the art will appreciate that various adaptations andmodifications of the just-described preferred embodiment can beconfigured without departing from the scope and spirit of the invention.Therefore, it is to be understood that, within the scope of the appendedclaims, the invention may be practiced other than as specificallydescribed herein.

1. A transceiver system for sending and receiving infrared signals,comprising: a circuit structure defined by a front side and a back side;at least one infrared emitting device located on said front side; atleast one infrared detecting device also located on said front side; atransceiver circuit device located on said front side, said infrareddetecting device further comprising a front side and a back side, saidinfrared detecting device back side aligned to face said front side ofsaid circuit structure, said infrared emitting device further comprisinga back side, said infrared emitting device back side aligned to facesaid infrared detecting device front side, whereby said infraredemitting device and said infrared detection device form an integratedinfrared emitting and infrared detection device, said integratedinfrared emitting/infrared detection device is located on said frontside of said transceiver circuit device to form a transceiver/infraredemitting/infrared detection device stack; a primary lens elementproviding an optical path, said primary lens element and saidtransceiver/infrared emitting/infrared detection device stackcooperatively located such that said transceiver/infraredemitting/infrared detection device stack is aligned with said opticalpath; and a secondary lens unit separated by a distance from saidprimary lens element and aligned along said optical path, the primarylens element located between the secondary lens unit and the at leastone infrared emitting device, the secondary lens unit causing a ray tobe refracted such that the angle of the ray with respect to thesecondary lens unit is modified by passing through the secondary lensunit.
 2. The system of claim 1, further comprising: a housingencapsulating said transceiver/infrared emitting/infrared detectiondevice stack.
 3. An improved process for transmitting and receivinginfrared signals from an infrared transceiver assembly comprising acircuit structure defining a first side and a second side, a transceivercircuit device, at least one infrared emitting device and at least oneinfrared detection device, the steps comprising: transmitting infraredsignals by transmitting signals to said transceiver circuit device, saidtransceiver circuit device being located on said first side; passingsaid signals through said transceiver circuit device and to saidinfrared emitting device, said infrared emitting device located on saidsecond side; emitting infrared signals from said infrared emittingdevice; receiving infrared signals by receiving infrared signals withsaid infrared detection device, said infrared emitting device beingstacked upon said infrared detection device to form an integratedinfrared emitting/detection device stack; passing said received signalsto said transceiver circuit device; and passing said received signalsaway from said transceiver circuit device.
 4. The process of claim 3,wherein said first passing comprises passing said signals to saidinfrared emitting device via said circuit structure, said circuitstructure comprising a printed circuit board, and wherein said secondpassing comprises passing said received signals to said transceivercircuit device via said circuit structure.
 5. An optical communicationdevice for transmitting and receiving optical communication signals,comprising: an optical receiving device that receives a first opticalsignal at a first surface; an optical transmission device that emits asecond optical signal from a second surface, the first and secondsurfaces facing in a common direction; a support element, the opticalreceiving device and the optical transmission device mounted to a firstside of the support element; and a transceiver device in communicationwith both the optical transmission device and the optical receivingdevice, the transceiver device mounted on a second side of the supportelement, the second side in opposition to the first side.
 6. The opticalcommunication device of claim 5, wherein the support element is aprinted circuit board.
 7. The optical communication device of claim 5,wherein the optical receiving device and the optical transmission deviceare both directly mounted to the first side of the support element andare spaced apart along the first side of the support element.
 8. Theoptical communication device of claim 5, wherein the opticaltransmission device is mounted on the optical receiving device, and theoptical receiving device is mounted on the first side of the supportelement.
 9. The optical communication device of claim 5, wherein thetransceiver device has a circuit on a third surface, the third surfacefacing the second side of the support element.
 10. The opticalcommunication device of claim 5, wherein the transceiver device has acircuit on a third surface, the third surface facing away from thesecond side of the support element.
 11. The optical communication deviceof claim 5, further comprising: a transmission lens that passes a rayfrom the optical transmission device.
 12. The optical communicationdevice of claim 5, further comprising: a receiving lens that passes aray to the optical receiving device.
 13. The optical communicationdevice of claim 5, further comprising: a single lens that passes a firstray from the optical transmission device and passes a second ray to theoptical receiving device.
 14. A transceiver system for sending andreceiving infrared signals, comprising: a circuit structure having afront side; an infrared emitting device having a back side; an infrareddetection device having a front side and a back side; a transceivercircuit device having a front side and a back side, said infrareddetecting device back side aligned to face said front side of saidtransceiver circuit device, said infrared emitting device back sidealigned to face said infrared detection device front side, wherein saidinfrared emitting device and said infrared detection device form anintegrated infrared emitting/infrared detection device, said integratedinfrared emitting/infrared detection device located on said front sideof said transceiver circuit device to form a transceiver/infraredemitting/infrared detection device stack located on said front side ofsaid circuit structure; a primary lens element, said primary lenselement and said transceiver/infrared emitting/infrared detection devicestack being oriented such that an optical path originating from saidinfrared emitting device passes through said primary lens element,wherein a ray travels from said infrared emitting device along saidoptical path; and a secondary lens element separated by a distance fromsaid primary lens element and aligned along said optical path, saidprimary lens element located between said secondary lens element andsaid infrared emitting device, said secondary lens element causing saidray to be refracted such that an angle of said ray with respect to saidsecondary lens element is modified by passing through said secondarylens element.
 15. The transceiver system of claim 14, wherein saidprimary lens element and said transceiver/infrared emitting/infrareddetection device stack are oriented such that said optical path fromsaid infrared emitting device is reflected by a mirror and then passesthrough said primary lens element.
 16. The transceiver system of claim14, wherein said primary lens element comprises a different refractivepower than that of said secondary lens element.
 17. The transceiversystem of claim 14, wherein said primary lens element has no refractivepower.
 18. The transceiver system of claim 14, wherein said secondarylens element exhibits a plurality of different refractive powers. 19.The transceiver system of claim 18, wherein said secondary lens elementcomprises a separate region for each of said plurality of differentrefractive powers.
 20. The transceiver system of claim 19, wherein eachof said separate regions comprises a single refractive power.
 21. Thetransceiver system of claim 14, further comprising: a housingencapsulating said transceiver/infrared emitting/infrared detectiondevice stack, said housing comprising a wall at least partially definedby said primary lens element.
 22. The transceiver system of claim 21,wherein said wall has an outer surface that is substantially flat.